Manufacturing vapor chambers for thermal management essential for higher performance and diversifying electronics.
Developing the next generation of low-cost, high-performance vapor chambers
🔲 Various design heat sink
Heat dissipation is gaining traction as the next generation of thermal management solutions through thermal efficiency, lightweighting, and complex structure implementation.
Widely utilized in industries where heat generation is a critical factor.
Used to cool electronic devices and semiconductors, LED lighting, and power modules
- Developed next-generation high-performance vapor chamber with mesh wicks printed by metal 3D printing technology to maximize surface area
- Water absorption test result of mesh form: 2 seconds
